검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Modeling copper CMP removal rate dependency on wafer pressure, velocity, and dissolved oxygen concentration DeNardis D, Doi T, Hiskey B, Ichikawa K, Ichikawa D, Philipossian A Journal of the Electrochemical Society, 153(5), G428, 2006 |
| 2 |
Impact of gaseous additives on copper CMP in neutral and alkaline solutions using a CAP system DeNardis D, Doi T, Hiskey B, Ichikawa K, Ichikawa D, Philipossian A Journal of the Electrochemical Society, 152(11), G824, 2005 |