검색결과 : 6건
| No. | Article |
|---|---|
| 1 |
MEMS on cavity-SOI wafers Luoto H, Henttinen K, Suni T, Dekker J, Makinen J, Torkkeli A Solid-State Electronics, 51(2), 328, 2007 |
| 2 |
Wafer scale packaging of MEMS by using plasma-activated wafer bonding Suni T, Henttinen K, Lipsanen A, Dekker J, Luoto H, Kulawski M Journal of the Electrochemical Society, 153(1), G78, 2006 |
| 3 |
Silicon-on-insulator wafers with buried cavities Suni T, Henttinen K, Dekker J, Luoto H, Kulawski M, Makinen J, Mutikainen R Journal of the Electrochemical Society, 153(4), G299, 2006 |
| 4 |
Direct bonding of thick film polysilicon to glass substrates Luoto H, Suni T, Henttinen K, Kulawski M Journal of the Electrochemical Society, 153(11), G981, 2006 |
| 5 |
Strain and electrical characterization of metal-oxide-semiconductor field-effect transistor fabricated on mechanically and thermally transferred silicon on insulator films Lu F, Bickford J, Novotny C, Yu PKL, Lau SS, Henttinen K, Suni T, Suni I Journal of Vacuum Science & Technology B, 22(6), 2691, 2004 |
| 6 |
Effects of plasma activation on hydrophilic bonding of Si and SiO2 Suni T, Henttinen K, Suni I, Makinen J Journal of the Electrochemical Society, 149(6), G348, 2002 |