검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper-solder interface Liu Y, Wang J, Yin L, Kondos P, Parks C, Borgesen P, Henderson DW, Cotts EJ, Dimitrov N Journal of Applied Electrochemistry, 38(12), 1695, 2008 |