화학공학소재연구정보센터
검색결과 : 10건
No. Article
1 Effect of the relative degree of foulant "hydrophobicity" on membrane fouling
Mu ST, Wang S, Liang S, Xiao K, Fan HJ, Han BJ, Liu C, Wang XM, Huang X
Journal of Membrane Science, 570, 1, 2019
2 Determination of Surface Energy Parameters of Hydrophilic Porous Membranes via a Corrected Contact Angle Approach
Han BJ, Wang XM, Zheng JZ, Liang S, Xiao K, Yu JL, Qian Z, Huang X
Langmuir, 35(47), 15009, 2019
3 Efficient degradation of sulfamethoxazole by the Fe(II)/HSO5- process enhanced by hydroxylamine: Efficiency and mechanism
Liu GF, Li XC, Han BJ, Chen LW, Zhu LN, Campos LC
Journal of Hazardous Materials, 322, 461, 2017
4 Engineering the thermostability of beta-glucuronidase from Penicillium purpurogenum Li-3 by loop transplant
Feng XD, Tang H, Han BJ, Zhang L, Lv B, Li C
Applied Microbiology and Biotechnology, 100(23), 9955, 2016
5 Enhancing the Thermostability of beta-Glucuronidase by Rationally Redesigning the Catalytic Domain Based on Sequence Alignment Strategy
Feng XD, Tang H, Han BJ, Lv B, Li C
Industrial & Engineering Chemistry Research, 55(19), 5474, 2016
6 Changes of skeletal muscle adiponectin content in diet-induced insulin resistant rats
Yang BC, Chen LH, Qian Y, Triantafillou JA, McNulty JA, Carrick K, Clifton LG, Han BJ, Geske R, Strum J, Brown KK, Stimpson SA, Pahel G
Biochemical and Biophysical Research Communications, 341(1), 209, 2006
7 Synthesis and Properties of Poly(aryl sulfone) Containing Cross-linkable Dicyanovinyl Group
Kim JH, Lee SY, Han BJ
Korea Polymer Journal, 7(2), 73, 1999
8 Evaluation of Epoxy Underfill Materials for Solder Flip-Chip Technology
Park CE, Han BJ, Bair HE, Raju VR
Journal of Materials Science Letters, 16(12), 1027, 1997
9 Synthesis and Properties of New Thermally Stable, Cross-linkable Poly(imide-enaminonitrile)s
Kim JH, Han BJ, Choi KY, Suh DH, Hong YT
Korea Polymer Journal, 5(1), 33, 1997
10 Humidity Effects on Adhesion Strength Between Solder Ball and Epoxy Underfills
Park CE, Han BJ, Bair HE
Polymer, 38(15), 3811, 1997