1 |
On the presence of Ga2O sub-oxide in high-pressure water vapor annealed AlGaN surface by combined XPS and first-principles methods Escano MCS, Asubar JT, Yatabe Z, David MY, Uenuma M, Tokuda H, Uraoka Y, Kuzuhara M, Tani M Applied Surface Science, 481, 1120, 2019 |
2 |
Determination of the input parameters for inelastic background analysis combined with HAXPES using a reference sample Zborowski C, Renault O, Torres A, Yamashita Y, Grenet G, Tougaard S Applied Surface Science, 432, 60, 2018 |
3 |
Analysis of reverse gate leakage mechanism of AlGaN/GaN HEMTs with N-2 plasma surface treatment Liu H, Zhang ZJ, Luo WJ Solid-State Electronics, 144, 60, 2018 |
4 |
Achievement of normally-off AlGaN/GaN high-electron mobility transistor with p-NiOx capping layer by sputtering and post-annealing Huang SJ, Chou CW, Su YK, Lin JH, Yu HC, Chen DL, Ruan JL Applied Surface Science, 401, 373, 2017 |
5 |
Performance optimization of lateral AlGaN/GaN HEMTs with cap gate on 150-mm silicon substrate Sun H, Liu MH, Liu P, Lin XN, Cui XL, Chen JG, Chen DM Solid-State Electronics, 130, 28, 2017 |
6 |
Study on the electrical degradation of AlGaN/GaN MIS-HEMTs induced by residual stress of SiNX passivation Bai ZY, Du JF, Liu Y, Xin Q, Liu Y, Yu Q Solid-State Electronics, 133, 31, 2017 |
7 |
Neutral beam process in AlGaN/GaN HEMTs: Impact on current collapse Hemmi F, Thomas C, Lai YC, Higo A, Watamura Y, Samukawa S, Otsuji T, Suemitsu T Solid-State Electronics, 137, 1, 2017 |
8 |
A compact drain current model for heterostructure HEMTs including 2DEG density solution with two subbands Deng WL, Huang JK, Ma XY, Liou JJ, Yu F Solid-State Electronics, 115, 54, 2016 |
9 |
A compact model of the reverse gate-leakage current in GaN-based HEMTs Ma XY, Huang JK, Fang JL, Deng WL Solid-State Electronics, 126, 10, 2016 |
10 |
Multibias and thermal behavior of microwave GaN and GaAs based HEMTs Alim MA, Rezazadeh AA, Gaquiere C Solid-State Electronics, 126, 67, 2016 |