검색결과 : 52건
| No. | Article |
|---|---|
| 1 |
Copper ion transport induced dielectric failure: Inclusion of elastic drift and consequences for reliability (vol 26, pg 1497, 2008) Achanta RS, Plawsky JL, Gill WN Journal of Vacuum Science & Technology A, 27(1), 165, 2009 |
| 2 |
The effect of metallic barriers in inhibiting copper ion transport in low-k dielectrics: Implications for time-to-failure Achanta RS, Plawsky JL, Gill WN, Kim YH Thin Solid Films, 517(19), 5630, 2009 |
| 3 |
Copper ion transport induced dielectric failure: Inclusion of elastic drift and consequences for reliability Achanta RS, Plawsky JL, Gill WN Journal of Vacuum Science & Technology A, 26(6), 1497, 2008 |
| 4 |
Design of diffusion barriers Gill WN, Plawsky JL Thin Solid Films, 515(11), 4794, 2007 |
| 5 |
Fabrication of ultrathin (similar to 100 nm), low-index nanoporous silica films for photonic devices: Role of substrate adhesion on the film thickness Ojha M, Gill WN, Plawsky JL, Cho W Journal of Vacuum Science & Technology B, 24(3), 1109, 2006 |
| 6 |
Role of reactive surface oxygen in causing enhanced copper ionization in a low-k polymer Achanta RS, Gill WN, Plawsky JL, Haase G Journal of Vacuum Science & Technology B, 24(3), 1417, 2006 |
| 7 |
Diffusion of copper in nanoporous dielectric films Rodriguez O, Saxena R, Cho WJ, Plawsky JL, Gill WN Industrial & Engineering Chemistry Research, 44(5), 1220, 2005 |
| 8 |
A model for the etching of nanoporous silica in C4F8 plasmas based on pore geometry and porosity effects Cho WJ, Rodriguez O, Saxena R, Ojha M, Chanta RA, Plawsky JL, Gill WN Journal of the Electrochemical Society, 152(2), F26, 2005 |
| 9 |
Polymer penetration and pore sealing in nanoporous silica by CHF3 plasma exposure Cho WJ, Saxena R, Rodriguez O, Ojha M, Achanta R, Plawsky JL, Gill WN Journal of the Electrochemical Society, 152(6), F61, 2005 |
| 10 |
A feature scale model for chemical mechanical planarization of damascene structures Saxena R, Thakurta DG, Gutmann RJ, Gill WN Thin Solid Films, 449(1-2), 192, 2004 |