검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Electromigration cu mass flow in cu interconnections Hu CK, Canaperi D, Chen ST, Gignac LM, Kaldor S, Krishnan M, Malhotra SG, Liniger E, Lloyd JR, Rath DL, Restaino D, Rosenberg R, Rubino J, Seo SC, Simon A, Smith S, Tseng WT Thin Solid Films, 504(1-2), 274, 2006 |
| 2 |
Electromigration in AlCu lines: comparison of Dual Damascene and metal reactive ion etching Filippi RG, Gribelyuk MA, Joseph T, Kane T, Sullivan TD, Clevenger LA, Costrini G, Gambino J, Iggulden RC, Kiewra EW, Ning XJ, Ravikumar R, Schnabel RF, Stojakovic G, Weber SJ, Gignac LM, Hu CK, Rath DL, Rodbell KP Thin Solid Films, 388(1-2), 303, 2001 |
| 3 |
Porous SiO2-Films Analyzed by Transmission Electron-Microscopy Gignac LM, Parrill TM, Chandrashekhar GV Thin Solid Films, 261(1-2), 59, 1995 |