검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Electromigration in AlCu lines: comparison of Dual Damascene and metal reactive ion etching Filippi RG, Gribelyuk MA, Joseph T, Kane T, Sullivan TD, Clevenger LA, Costrini G, Gambino J, Iggulden RC, Kiewra EW, Ning XJ, Ravikumar R, Schnabel RF, Stojakovic G, Weber SJ, Gignac LM, Hu CK, Rath DL, Rodbell KP Thin Solid Films, 388(1-2), 303, 2001 |
| 2 |
Electromigration Behavior of Hot-Sputtered Al(Cu) Versus Chemical-Vapor-Deposition W Vias Filippi RG, Levine EN, Rodbell KP Journal of Vacuum Science & Technology B, 15(3), 750, 1997 |