검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Copper electroplating to fill blind vias for three-dimensional integration Spiesshoefer S, Patel J, Lam T, Cai L, Polamreddy S, Figueroa RF, Burkett SL, Schaper L, Geil R, Rogers B Journal of Vacuum Science & Technology A, 24(4), 1277, 2006 |
| 2 |
Control of sidewall slope in silicon vias using SF6/O-2 plasma etching in a conventional reactive ion etching tool Figueroa RF, Spiesshoefer S, Burkett SL, Schaper L Journal of Vacuum Science & Technology B, 23(5), 2226, 2005 |