화학공학소재연구정보센터
검색결과 : 25건
No. Article
1 Electroless Deposition of Copper-Manganese for Applications in Semiconductor Interconnect Metallization
Yu L, Vashaei Z, Ernst F, Akolkar R
Journal of the Electrochemical Society, 163(8), D374, 2016
2 Properties of the Passive Film Formed on Interstitially Hardened AISI 316L Stainless Steel
Niu W, Lillard RS, Li Z, Ernst F
Electrochimica Acta, 176, 410, 2015
3 Energy Transfer in Nanotube-Perylene Complexes
Ernst F, Heek T, Setaro A, Haag R, Reich S
Advanced Functional Materials, 22(18), 3921, 2012
4 The Platinum/Titanium-Nitride Interface: X-Ray Photoelectron Spectroscopy Studies
Matic N, Chottiner GS, Ernst F, Scherson D
Electrochemical and Solid State Letters, 15(6), B79, 2012
5 Synthesis, characterization of a CoSe2 catalyst for the oxygen reduction reaction
Zhu L, Teo M, Wong PC, Wong KC, Narita I, Ernst F, Mitchell KAR, Campbell SA
Applied Catalysis A: General, 386(1-2), 157, 2010
6 Regulation of acetoin and 2,3-butanediol utilization in Bacillus licheniformis
Thanh T, Jurgen B, Bauch M, Liebeke M, Lalk M, Ehrenreich A, Evers S, Maurer KH, Antelmann H, Ernst F, Homuth G, Hecker M, Schweder T
Applied Microbiology and Biotechnology, 87(6), 2227, 2010
7 Carburization-Enhanced Passivity of PH13-8 Mo: A Precipitation-Hardened Martensitic Stainless Steel
Heuer AH, Kahn H, O'Donnell LJ, Ernst F, Michal GM, Rayne RJ, Martin FJ, Natishan PM
Electrochemical and Solid State Letters, 13(12), C37, 2010
8 Carburization-induced passivity of 316 L austenitic stainless steel
Martin FJ, Lemieux EJ, Newbauer TM, Bayles RA, Natishan PM, Kahn H, Michal GM, Ernst F, Heuerd AH
Electrochemical and Solid State Letters, 10(12), C76, 2007
9 Diffusion reactions at Al-MgAl2O4 interfaces - and the effect of applied electric fields
Yu Y, Mark J, Ernst F, Wagner T, Raj R
Journal of Materials Science, 41(23), 7785, 2006
10 Epitaxial growth of cuprous oxide electrodeposited onto semiconductor and metal substrates
Oba F, Ernst F, Yu YS, Liu R, Kothari M, Switzer JA
Journal of the American Ceramic Society, 88(2), 253, 2005