검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Planar copper plating and electropolishing techniques Basol BM, Uzoh CE, Talieh H, Wang T, Guo G, Erdemli S, Cornejo M, Bogart J, Basol EC Chemical Engineering Communications, 193(7), 903, 2006 |
| 2 |
Planarization efficiency of electrochemical mechanical deposition and its dependence on process parameters Basol BM, Erdemli S, Uzoh CE, Wang T Journal of the Electrochemical Society, 153(3), C176, 2006 |
| 3 |
Mechanically induced growth rate differential for copper layers electroplated in presence of organic additives Basol BM, Durmus A, Wang T, Erdemli S, Bogart J Journal of the Electrochemical Society, 153(10), C683, 2006 |
| 4 |
Characterization of copper layers grown by electrochemical mechanical deposition technique Wang T, Lindquist P, Erdemli S, Basol EC, Zhang R, Uzoh CE, Basol BM Thin Solid Films, 478(1-2), 345, 2005 |