검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
The effect of hydrogen peroxide in a citric acid based copper slurry on Cu polishing Eom DH, Kim IK, Han JH, Park JG Journal of the Electrochemical Society, 154(1), D38, 2007 |
| 2 |
The effect of additives in post-Cu CMP cleaning on particle adhesion and removal Hong YK, Eom DH, Lee SH, Kim TG, Park JG, Busnaina AA Journal of the Electrochemical Society, 151(11), G756, 2004 |