1 |
Thin films of relaxor ferroelectric/antiferroelectric heterolayered structure for energy storage Nguyen MD, Rijnders G Thin Solid Films, 659, 89, 2018 |
2 |
Self-assembly and electrical characteristics of 4-pentynoic acid functionalized Fe3O4-gamma-Fe2O3 nanoparticles on SiO2/n-Si Baharuddin AA, Ang BC, Wong YH Applied Surface Science, 423, 236, 2017 |
3 |
Mechanical induced electrical failure of shock compressed PZT95/5 ferroelectric ceramics Nie HC, Yang J, Chen XF, Zhang FP, Yu Y, Wang GS, Liu YS, He HL, Dong XL Current Applied Physics, 17(4), 448, 2017 |
4 |
Scanning Tunneling Microscopy Study of the Multi-Step Deposited and Annealed HfSiOx Gate Dielectric Yew KS, Ang DS, Tang LJ, Cui K, Bersuker G, Lysaght PS Journal of the Electrochemical Society, 158(10), H1021, 2011 |
5 |
Measurement of particle size distribution of silica nanoparticles by interactive force apparatus under an electric field Otsuki A, Dodbiba G, Fujita T Advanced Powder Technology, 21(4), 419, 2010 |
6 |
Reduced Metal Contamination in Atomic-Layer-Deposited HfO2 Films Grown on Si Using O-3 Oxidant Generated Without N-2 Assistance Park TJ, Chung KJ, Kim HC, Ahn J, Wallace RM, Kim J Electrochemical and Solid State Letters, 13(8), G65, 2010 |
7 |
A Nonvolatile Memory Capacitor Based on a Double Gold Nanocrystal Storing Layer and High-k Dielectric Tunneling and Control Layers Mikhelashvili V, Meyler B, Yofis S, Salzman J, Garbrecht M, Cohen-Hyams T, Kaplan WD, Eisenstein G Journal of the Electrochemical Society, 157(4), H463, 2010 |
8 |
Ultralow-k/Cu Damascene Multilevel Interconnects Using High Porosity and High Modulus Self-Assembled Porous Silica Chikaki S, Kinoshita K, Kohmura K, Tanaka H, Soda E, Suzuki T, Seino Y, Hata N, Saito S, Kikkawa T Journal of the Electrochemical Society, 157(5), H519, 2010 |
9 |
Configuration-dependent enhancements of electric fields near the quadruple and the triple junction Chung MS, Yoon BG, Cutler PH, Miskovsky NM, Weiss BL, Mayer A Journal of Vacuum Science & Technology B, 28(2), C2A94, 2010 |
10 |
Electrical and reliability performances of nitrogen-incorporated silicon carbide dielectric by chemical vapor deposition Cheng YL, Chen SA, Chiu TJ, Wu J, Wei BJ, Chang HJ Journal of Vacuum Science & Technology B, 28(3), 573, 2010 |