검색결과 : 6건
| No. | Article |
|---|---|
| 1 |
Mechanism of Co Liner as Enhancement Layer for Cu Interconnect Gap-Fill He M, Zhang X, Nogami T, Lin X, Kelly J, Kim H, Spooner T, Edelstein D, Zhao L Journal of the Electrochemical Society, 160(12), D3040, 2013 |
| 2 |
Electrodeposited Cu Film Morphology on Thin PVD Cu Seed Layers Kelly J, Lin X, Nogami T, van der Straten O, Demarest J, Li J, Murphy R, Zhang X, Penny C, Parks C, Edelstein D Journal of the Electrochemical Society, 160(12), D3171, 2013 |
| 3 |
Effects of Contact Area on Mechanical Strength, Electrical Resistance, and Electromigration Reliability of Cu/Low-k Interconnects Yang CC, Shaw T, Simon A, Edelstein D Electrochemical and Solid State Letters, 13(6), II197, 2010 |
| 4 |
Normalizing mitochondrial superoxide production blocks three pathways of hyperglycaemic damage Nishikawa T, Edelstein D, Du XL, Yamagishi S, Matsumura T, Kaneda Y, Yorek MA, Beebe D, Oates PJ, Hammes HP, Giardino I, Brownlee M Nature, 404(6779), 787, 2000 |
| 5 |
Computing vibrational energy relaxation for high-frequency modes in condensed environments (vol 107, pg 10470, 1997) Rostkier-Edelstein D, Graf P, Nitzan A Journal of Chemical Physics, 108(22), 9598, 1998 |
| 6 |
Computing vibrational energy relaxation for high-frequency modes in condensed environments Rostkier-Edelstein D, Graf P, Nitzan A Journal of Chemical Physics, 107(24), 10470, 1997 |