검색결과 : 2건
No. | Article |
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1 |
Understanding the evolution of trench profiles in the via-first dual damascene integration scheme Kropewnicki T, Doan K, Tang B, Bjorkman C Journal of Vacuum Science & Technology A, 19(4), 1384, 2001 |
2 |
Magnetic field optimization in a dielectric magnetically enhanced reactive ion etch reactor to produce an instantaneously uniform plasma Lindley RA, Bjorkman CH, Shan H, Ke KH, Doan K, Mett RR, Welch M Journal of Vacuum Science & Technology A, 16(3), 1600, 1998 |