검색결과 : 10건
| No. | Article |
|---|---|
| 1 |
Influence of plasma process on III-V/Ge multijunction solar cell via etching de Lafontaine M, Pargon E, Petit-Etienne C, Gay G, Jaouad A, Gour MJ, Volatier M, Fafard S, Aimez V, Darnon M Solar Energy Materials and Solar Cells, 195, 49, 2019 |
| 2 |
Epitaxial lift-off of InGaAs solar cells from InP substrate using a strained AlAs/InAlAs superlattice as a novel sacrificial layer Chancerel F, Regreny P, Leclercq JL, Brottet S, Volatier M, Jaouad A, Darnon M, Fafard S, Blanchar NP, Gendry M, Aimez V Solar Energy Materials and Solar Cells, 195, 204, 2019 |
| 3 |
Patterning of porous SiOCH using an organic mask: Comparison with a metallic masking strategy Darnon M, Chevolleau T, David T, Ducote J, Posseme N, Bouyssou R, Bailly F, Perret D, Joubert O Journal of Vacuum Science & Technology B, 28(1), 149, 2010 |
| 4 |
Reducing damage to Si substrates during gate etching processes by synchronous plasma pulsing Petit-Etienne C, Darnon M, Vallier L, Pargon E, Cunge G, Boulard F, Joubert O, Banna S, Lill T Journal of Vacuum Science & Technology B, 28(5), 926, 2010 |
| 5 |
Hydrogen silsesquioxane-based hybrid electron beam and optical lithography for high density circuit prototyping Guillorn M, Chang J, Fuller N, Patel J, Darnon M, Pyzyna A, Joseph E, Engelmann S, Ott J, Newbury J, Klaus D, Bucchignano J, Joshi P, Scerbo C, Kratschmer E, Graham W, To B, Parisi J, Zhang Y, Haensch W Journal of Vacuum Science & Technology B, 27(6), 2588, 2009 |
| 6 |
Modifications of dielectric films induced by plasma ashing processes: Hybrid versus porous SiOCH materials Darnon M, Chevolleau T, David T, Posseme N, Ducote J, Licitra C, Vallier L, Joubert O, Torres J Journal of Vacuum Science & Technology B, 26(6), 1964, 2008 |
| 7 |
Analyses of chamber wall coatings during the patterning of ultralow-k materials with a metal hard mask: Consequences on cleaning strategies Chevolleau T, Darnon M, David T, Posseme N, Torres J, Joubert O Journal of Vacuum Science & Technology B, 25(3), 886, 2007 |
| 8 |
Mechanisms of porous dielectric film modification induced by reducing and oxidizing ash plasmas Posseme N, Chevolleau T, David T, Darnon M, Louveau O, Joubert O Journal of Vacuum Science & Technology B, 25(6), 1928, 2007 |
| 9 |
Etching characteristics of TiN used as hard mask in dielectric etch process Darnon M, Chevolleau T, Eon D, Vallier L, Torres J, Joubert O Journal of Vacuum Science & Technology B, 24(5), 2262, 2006 |
| 10 |
Towards a controlled patterning of 10 nm silicon gates in high density plasmas Pargon E, Darnon M, Joubert O, Chevolleau T, Vallier L, Mollard L, Lill T Journal of Vacuum Science & Technology B, 23(5), 1913, 2005 |