검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Deposition of a Continuous and Conformal Copper Seed Layer by a Large-Area Electron Cyclotron Resonance Plasma Source with Embedded Lisitano Antenna Jang SO, You HJ, Kim YW, Jung YH, Hwang IU, Park JY, Lee H Plasma Chemistry and Plasma Processing, 34(1), 229, 2014 |
| 2 |
Fabrication and characterization of a Cu seed layer on a 60-nm trench-patterned SiO2 substrate by a self-assembled-monolayer (SAM) process Han WK, Hwang GH, Hong SJ, Yoon CS, Park JS, Cho JK, Kang SG Applied Surface Science, 255(12), 6082, 2009 |
| 3 |
Customized step coverage of copper seed layer using Eni-PVD (energetic neutral and ion physical vapor deposition) Lim ST, Park YC, Yoo SJ, Lee BJ Thin Solid Films, 517(14), 3935, 2009 |
| 4 |
갈바니 치환 증착 방법을 이용한 확산방지막 위에서의 구리 시드층 형성 김재정, 강무성 HWAHAK KONGHAK, 39(6), 721, 2001 |