검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
The effect of tricyclazole as a novel leveler for filling electroplated copper microvias Liao CH, Zhang ST, Chen SJ, Qiang YJ, Liu G, Tang MX, Tan BC, Fu DL, Xu Y Journal of Electroanalytical Chemistry, 827, 151, 2018 |
| 2 |
Wetting process of copper filling in through silicon vias Zhang JH, Luo W, Li Y, Gao LM, Li M Applied Surface Science, 359, 736, 2015 |
| 3 |
Metal seed layer sputtering on high aspect ratio through-silicon-vias for copper filling electroplating Song YS, Yim T, Park SK, Lee JH, Kim J Electrochimica Acta, 114, 832, 2013 |
| 4 |
Copper filling of deep sub-mu m through-holes by high-vacuum planar magnetron sputtering using argon gas with added oxygen Uhara Y, Urano T, Itoh M, Hayashi H, Manba Y, Taniseki A, Jyan H, Nishikawa E, Saito S Applied Surface Science, 256(4), 1240, 2009 |