| 1 |
Evaluation of coating rate and adhesive force for copper deposition on the surface of polypropylene
Fulazzaky MA, Fulazzaky M, Sumeru K
Journal of Adhesion Science and Technology, 33(13), 1438, 2019 |
| 2 |
Computational analysis and experimental evidence of two typical levelers for acid copper electroplating
Lai ZQ, Wang SX, Wang C, Hong Y, Chen YM, Zhang HW, Zhou GY, He W, Ai KH, Peng YQ
Electrochimica Acta, 273, 318, 2018 |
| 3 |
Investigation of poly (1-vinyl imidazole co 1, 4-butanediol diglycidyl ether) as a leveler for copper electroplating of through-hole
Zheng L, He W, Zhu K, Wang C, Wang SX, Hong Y, Chen YM, Zhou GY, Miao H, Zhou JQ
Electrochimica Acta, 283, 560, 2018 |
| 4 |
Distinct Copper Electrodeposited Carbon Nanotubes (CNT) Tissues as Anode Current Collectors in Li-ion Battery
Yehezkel S, Auinat M, Sezin N, Starosvetsky D, Ein-Eli Y
Electrochimica Acta, 229, 404, 2017 |
| 5 |
Adsorption behavior of triblock copolymer suppressors during the copper electrodeposition
Xiao N, Li DY, Cui GF, Li N, Li Q, Wu G
Electrochimica Acta, 116, 284, 2014 |
| 6 |
Influence of branched quaternary ammonium surfactant molecules as levelers for copper electroplating from acidic sulfate bath
Wang AY, Chen B, Fang L, Yu JJ, Wang LM
Electrochimica Acta, 108, 698, 2013 |
| 7 |
Effects of organic acids on through-hole filling by copper electroplating
Yan JJ, Chang LC, Lu CW, Dow WP
Electrochimica Acta, 109, 1, 2013 |
| 8 |
An effective triblock copolymer as a suppressor for microvia filling via copper electrodeposition
Xiao N, Li DY, Cui GF, Li N, Tian D, Li Q, Wu G
Electrochimica Acta, 109, 226, 2013 |
| 9 |
Effects of pressure on electroplating of copper using supercritical carbon dioxide emulsified electrolyte
Chang TFM, Shimizu T, Ishiyama C, Sone M
Thin Solid Films, 529, 25, 2013 |
| 10 |
Effects of supporting electrolytes on copper electroplating for filling through-hole
Chen CH, Lu CW, Huang SM, Dow WP
Electrochimica Acta, 56(17), 5954, 2011 |
