| 1 |
Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning
Wei KH, Hung CC, Wang YS, Liu CP, Chen KW, Wang YL
Thin Solid Films, 618, 77, 2016 |
| 2 |
Functions of Trilon (R) P as a polyamine in copper chemical mechanical polishing
Jiang L, Lan YQ, He YY, Li YZ, Luo JB
Applied Surface Science, 288, 265, 2014 |
| 3 |
1,2,4-Triazole as a corrosion inhibitor in copper chemical mechanical polishing
Jiang L, Lan YQ, He YY, Li Y, Li YZ, Luo JB
Thin Solid Films, 556, 395, 2014 |
| 4 |
Synergetic effect of benzotriazole and non-ionic surfactant on copper chemical mechanical polishing in KIO4-based slurries
Jiang L, He YY, Niu XY, Li YZ, Luo JB
Thin Solid Films, 558, 272, 2014 |
| 5 |
Preparation of monodisperse polystyrene/silica core-shell nano-composite abrasive with controllable size and its chemical mechanical polishing performance on copper
Zhang L, Wang HB, Zhang ZF, Qin F, Liu WL, Song ZT
Applied Surface Science, 258(3), 1217, 2011 |
| 6 |
Electrochemical examination of surface films formed during chemical mechanical planarization of copper in acetic acid and dodecyl sulfate solutions
Zheng JP, Roy D
Thin Solid Films, 517(16), 4587, 2009 |
| 7 |
A study of copper chemical mechanical polishing in urea-hydrogen peroxide slurry by electrochemical impedance spectroscopy
Tsai TH, Wu YF, Yen SC
Applied Surface Science, 214(1-4), 120, 2003 |
