검색결과 : 5건
| No. | Article |
|---|---|
| 1 |
High-density-plasma (HDP)-CVD oxide to thermal oxide wafer bonding for strained silicon layer transfer applications Singh R, Radu I, Reiche M, Himcinschi C, Kuck B, Tillack B, Gosele U, Christiansen SH Applied Surface Science, 253(7), 3595, 2007 |
| 2 |
Uniaxially strained silicon by wafer bonding and layer transfer Himcinschi C, Radu I, Muster F, Singh R, Reiche M, Petzold M, Gosele U, Christiansen SH Solid-State Electronics, 51(2), 226, 2007 |
| 3 |
N-channel MOSFETs fabricated on He-implanted and annealed SiGe buffer layers Mooney PM, Rim K, Christiansen SH, Chan KK, Chu JO, Cai J, Chen H, Jordan-Sweet JL, Yang YY, Boyd DC Solid-State Electronics, 49(10), 1669, 2005 |
| 4 |
Optical and structural characterization of Si/SiGe heterostructures grown by RTCVD Sidiki T, Christiansen SH, Chabert S, de Boer WB, Ferrari C, Strunk HP, Torres CMS Thin Solid Films, 369(1-2), 431, 2000 |
| 5 |
Challenges in the brent field : Implementing depressurization Christiansen SH, Wilson PM Journal of Petroleum Technology, 50(2), 75, 1998 |