1 |
Operational Feasibility Analysis of Stand-Alone Methanol Fuel Processors with Flexible Waste Heat Recovery Schemes Wu W, Zhou YY, Chiu YS Industrial & Engineering Chemistry Research, 54(7), 2129, 2015 |
2 |
Single-step electrodeposition of CIS thin films with the complexing agent triethanolamine Chiu YS, Hsieh MT, Chang CM, Chen CS, Whang TJ Applied Surface Science, 299, 52, 2014 |
3 |
pH Sensor Investigation of Various-Length Photoelectrochemical Passivated ZnO Nanorod Arrays Chiu YS, Lee CT Journal of the Electrochemical Society, 158(9), J282, 2011 |
4 |
Structural and optical properties of Er(3+)-doped Y(2)Ti(2)O(7) thin films by sol-gel method Ting CC, Chang CW, Chuang LC, Li CH, Chiu YS Thin Solid Films, 518(20), 5704, 2010 |
5 |
Characteristics of high dielectric cubic Gd2O3 thin films deposited on cubic LaAlO3 by pulsed laser deposition Chang KS, Hsieh LZ, Huang SK, Lee CY, Chiu YS Journal of Crystal Growth, 310(7-9), 1961, 2008 |
6 |
Preparation and properties of high performance epoxy-silsesquioxane hybrid resins prepared using a maleimide-alkoxysilane compound as a modifier Liu YL, Chang GP, Wu CS, Chiu YS Journal of Polymer Science Part A: Polymer Chemistry, 43(23), 5787, 2005 |
7 |
Preparation and electromagnetic interference shielding characteristics of novel carbon-nanotube/siloxane/poly(urea urethane) nanocomposites Ma CCM, Huang YL, Kuan HC, Chiu YS Journal of Polymer Science Part B: Polymer Physics, 43(4), 345, 2005 |
8 |
Preparation and properties of nadic-end-capped cyclotriphosphazene-containing polyimide/carbon fiber composites Chen-Yang YW, Chen SF, Yuan CY, Lee HF, Li JL, Li CY, Chiu YS Journal of Applied Polymer Science, 90(3), 810, 2003 |
9 |
Using diethylphosphites as thermally latent curing agents for epoxy compounds Chiu YS, Liu YL, Wei WL, Chen WY Journal of Polymer Science Part A: Polymer Chemistry, 41(3), 432, 2003 |
10 |
Preparation, thermal properties, and flame retardance of epoxy-silica hybrid resins Liu YL, Wu CS, Chiu YS, Ho WH Journal of Polymer Science Part A: Polymer Chemistry, 41(15), 2354, 2003 |