검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Study on Stiffness and Conditioning Effects of CMP Pad Based on Physical Die-Level CMP Model Fan W, Boning D, Charns L, Miyauchi H, Tano H, Tsuji S Journal of the Electrochemical Society, 157(5), H526, 2010 |
| 2 |
Mechanical properties of chemical mechanical polishing pads containing water-soluble particles Charns L, Sugiyama M, Philipossian A Thin Solid Films, 485(1-2), 188, 2005 |
| 3 |
Arrhenius characterization of ILD and copper CMP processes Sorooshian J, DeNardis D, Charns L, Li Z, Shadman F, Boning D, Hetherington D, Philipossiana A Journal of the Electrochemical Society, 151(2), G85, 2004 |
| 4 |
Analysis of frictional heating of grooved and flat CMP polishing pads Borucki L, Charns L, Philipossian A Journal of the Electrochemical Society, 151(12), G809, 2004 |