1 |
Electrical characterization of vertically stacked p-FET SOI nanowires Paz BC, Casse M, Barraud S, Reimbold G, Vinet M, Faynot O, Pavanello MA Solid-State Electronics, 141, 84, 2018 |
2 |
Heat transfer investigation in rotating smooth square U-duct with different wall-temperature ratios and channel orientations Li Y, Deng HW, Xu GQ, Tian SQ International Journal of Heat and Mass Transfer, 89, 10, 2015 |
3 |
Effect of silicon channel orientation on analog performance of (110) surface pMOSFETs Kang TK Solid-State Electronics, 69, 104, 2012 |
4 |
Hole transport in DGSOI devices: Orientation and silicon thickness effects Donetti L, Gamiz F, Rodriguez N, Jimenez-Molinos F, Roldan JB Solid-State Electronics, 54(2), 191, 2010 |
5 |
Effects of switching from < 1 1 0 > to < 1 0 0 > channel orientation and tensile stress on n-channel and p-channel metal-oxide-semiconductor transistors Yang PZ, Lau WS, Lai SW, Lo VL, Siah SY, Chan L Solid-State Electronics, 54(4), 461, 2010 |
6 |
Modeling and validation of piezoresistive coefficients in Si hole inversion layers Pham AT, Jungemann C, Meinerzhagen B Solid-State Electronics, 53(12), 1325, 2009 |
7 |
Microscopic modeling of hole inversion layer mobility in unstrained and uniaxially stressed Si on arbitrarily oriented substrates Pham AT, Jungemann C, Meinerzhagen B Solid-State Electronics, 52(9), 1437, 2008 |
8 |
Impact of source-to-drain tunnelling on the scalability of arbitrary oriented alternative channel material nMOSFETs Rafhay Q, Clerc R, Ghibaudo G, Pananakakis G Solid-State Electronics, 52(10), 1474, 2008 |
9 |
High rotation number heat transfer of a 45 degrees rib-roughened rectangular duct with two channel orientations Liou TM, Chang SW, Hung JH, Chiou SF International Journal of Heat and Mass Transfer, 50(19-20), 4063, 2007 |
10 |
Impact of strain and channel orientation on the low-frequency noise performance of Si n- and pMOSFETs von Haartman M, Malm BG, Hellstrom PE, Ostling M, Grasby TJ, Whall TE, Parker EHC, Lyutovich K, Oehme M, Kasper E Solid-State Electronics, 51(5), 771, 2007 |