검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
BEOL Cu CMP Process Evaluation for Advanced Technology Nodes Tanwar K, Canaperi D, Lofaro M, Tseng WT, Patlolla R, Penny C, Waskiewicz C Journal of the Electrochemical Society, 160(12), D3247, 2013 |
| 2 |
Thermal Stability of Copper Contact Metallization Using Ru-Containing Liner Seo SC, Yang CC, Hu CK, Kerber A, Fan S, Horak D, Canaperi D, Rao SP, Haran B, Doris B Electrochemical and Solid State Letters, 14(5), H187, 2011 |
| 3 |
Electromigration cu mass flow in cu interconnections Hu CK, Canaperi D, Chen ST, Gignac LM, Kaldor S, Krishnan M, Malhotra SG, Liniger E, Lloyd JR, Rath DL, Restaino D, Rosenberg R, Rubino J, Seo SC, Simon A, Smith S, Tseng WT Thin Solid Films, 504(1-2), 274, 2006 |