1 |
Effects of extended poly gate on the performance of strained P-type metal-oxide-semiconductor field-effect transistors with a narrow channel width Lee CC, Liu CH, Hsu HW, Hung MH Thin Solid Films, 557, 311, 2014 |
2 |
Mechanical property effects of Si-1 (-) Ge-x(x) channel and stressed contact etching stop layer on nano-scaled n-type metal-oxide-semiconductor field effect transistors Lee CC, Cheng HC, Hsu HW, Chen ZH, Teng HH, Liu CH Thin Solid Films, 557, 316, 2014 |
3 |
Investigation of consequent process-induced stress for N-type metal oxide semiconductor field effect transistor with a sunken shallow trench isolation pattern Lee CC, Liu CH, Deng RH, Hsu HW, Chiang KN Thin Solid Films, 557, 323, 2014 |
4 |
Simulation-based sensitivity estimation of the geometric effect of poly gates on nanoscale n-type metal-oxide-semiconductor field-effect transistors with silicon-carbon alloy Lee CC, Liu CH, Teng HH Thin Solid Films, 570, 336, 2014 |
5 |
Nanoscale CMOSFET performance improvement and reliability study for local strain techniques Huang HL, Chen JK, Houng MP Solid-State Electronics, 79, 31, 2013 |
6 |
Phenomena of n-type metal-oxide-semiconductor-field-effect-transistors with contact etch stop layer stressor for different channel lengths Hsu HW, Lin KC, Lee CC, Twu MJ, Huang HS, Chen SY, Peng MR, Teng HH, Liu CH Thin Solid Films, 544, 120, 2013 |
7 |
Strain engineering of nanoscale Si MOS devices Huang J, Chang ST, Hsieh BF, Liao MH, Wang WC, Lee CC Thin Solid Films, 518, S241, 2010 |
8 |
High gate voltage drain current leveling off and its low-frequency noise in 65 nm fully-depleted strained and non-strained SOI nMOSFETs LukyanchikovA N, Garbar N, Kudina V, Smolanka A, Lokshin M, Simoen E, Claeys C Solid-State Electronics, 52(5), 801, 2008 |
9 |
Impact strain engineering on gate stack quality and reliability Claeys C, Simoen E, Put S, Giusi G, Crupi F Solid-State Electronics, 52(8), 1115, 2008 |
10 |
Impacts of a buffer layer and hydrogen-annealed wafers on the performance of strained-channel nMOSFETs with SiN-capping layer Tsai TI, Lin HC, Lee YJ, Chen KS, Wang J, Hsueh FK, Chao TS, Huang TY Solid-State Electronics, 52(10), 1518, 2008 |