검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Effect of Free Radical Activation for Low Temperature Si to Si Wafer Bonding Byun KY, Ferain I, Colinge C Journal of the Electrochemical Society, 157(1), H109, 2010 |
| 2 |
Joule열이 Sn-3.5Ag 플립칩 솔더범프의 Electromigration 거동에 미치는 영향 이장희, 양승택, 서민석, 정관호, 변광유, 박영배 Korean Journal of Materials Research, 17(2), 91, 2007 |
| 3 |
Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique Lee WS, Han IY, Yu J, Kim SJ, Byun KY Thermochimica Acta, 455(1-2), 148, 2007 |