검색결과 : 25건
| No. | Article |
|---|---|
| 1 |
Citric Acid and NaIO4 Based Alkaline Cleaning Solution for Particle Removal during Post-Ru CMP Cleaning Kim IK, Prasad YN, Kwon TY, Kim HM, Busnaina AA, Park JG Journal of the Electrochemical Society, 158(10), H1052, 2011 |
| 2 |
Analysis of Scratches Formed on Oxide Surface during Chemical Mechanical Planarization Choi JG, Prasad YN, Kim IK, Kim IG, Kim WJ, Busnaina AA, Park JG Journal of the Electrochemical Society, 157(2), H186, 2010 |
| 3 |
Effect of Different Deposition Mediums on the Adhesion and Removal of Particles Hu S, Kim TH, Park JG, Busnaina AA Journal of the Electrochemical Society, 157(6), H662, 2010 |
| 4 |
Effect of Polysilicon Wettability on Polishing and Organic Defects during CMP Park JG, Prasad YN, Kang YJ, Kim IK, Hong YK, Han SY, Yun SK, Yoon BU, Busnaina AA Journal of the Electrochemical Society, 156(11), H869, 2009 |
| 5 |
Convective Assembly and Dry Transfer of Nanoparticles Using Hydrophobic/Hydrophilic Monolayer Templates Cha NG, Echegoyen Y, Kim TH, Park JG, Busnaina AA Langmuir, 25(19), 11375, 2009 |
| 6 |
The effect of frictional and adhesion forces attributed to slurry particles on the surface quality of polished copper Hong YK, Han JH, Kim TG, Park JG, Busnaina AA Journal of the Electrochemical Society, 154(1), H36, 2007 |
| 7 |
Experimental and analytical study of submicrometer particle removal from deep trenches Bakhtari K, Guldiken RO, Busnaina AA, Park JG Journal of the Electrochemical Society, 153(9), C603, 2006 |
| 8 |
Interfacial and electrokinetic characterization of IPA solutions related to semiconductor wafer drying and cleaning Park JG, Lee SH, Ryu JS, Hong YK, Kim TG, Busnaina AA Journal of the Electrochemical Society, 153(9), G811, 2006 |
| 9 |
Experimental and numerical investigation of nanoparticle removal using acoustic streaming and the effect of time Bakhtari K, Guldiken RO, Makaram P, Busnaina AA, Park JG Journal of the Electrochemical Society, 153(9), G846, 2006 |
| 10 |
The effect of additives in post-Cu CMP cleaning on particle adhesion and removal Hong YK, Eom DH, Lee SH, Kim TG, Park JG, Busnaina AA Journal of the Electrochemical Society, 151(11), G756, 2004 |