검색결과 : 11건
| No. | Article |
|---|---|
| 1 |
Impact of line edge roughness on copper interconnects Leunissen LHA, Zhang W, Wu W, Brongersma SH Journal of Vacuum Science & Technology B, 24(4), 1859, 2006 |
| 2 |
Impurity incorporation during copper electrodeposition in the curvature-enhanced accelerator coverage regime Zhang W, Brongersma SH, Conard T, Wu W, Van Hove M, Vandervorst W, Maex K Electrochemical and Solid State Letters, 8(7), C95, 2005 |
| 3 |
Geometry effect on impurity incorporation and grain growth in narrow copper lines Zhang W, Brongersma SH, Heylen N, Beyer G, Vandervorst W, Maex K Journal of the Electrochemical Society, 152(12), C832, 2005 |
| 4 |
Plasma modification of porous low-k dielectrics Le QT, Whelan CM, Struyf H, Bender H, Conard T, Brongersma SH, Boullart W, Vanhaelemeersch S, Maex K Electrochemical and Solid State Letters, 7(9), F49, 2004 |
| 5 |
Corrosion of narrow copper damascene interconnects Ernur D, Terzieva V, Wu W, Brongersma SH, Maex K Journal of the Electrochemical Society, 151(12), B636, 2004 |
| 6 |
Fabrication of 100 nm pitch copper interconnects by electron beam lithography Wu W, Jonckheere R, Tokei Z, Brongersma SH, Van Hove M, Maez K Journal of Vacuum Science & Technology B, 22(4), L11, 2004 |
| 7 |
Surface and grain boundary scattering studied in beveled polycrystalline thin copper films Zhang W, Brongersma SH, Clarysse T, Terzieva V, Rosseel E, Vandervorst W, Maex K Journal of Vacuum Science & Technology B, 22(4), 1830, 2004 |
| 8 |
Microstructure and resistivity characterization of CuAuI superlattice formed in Gu/Au thin films Zhang W, Brongersma SH, Richard O, Brijs B, Palmans R, Froyen L, Maex K Journal of Vacuum Science & Technology B, 22(6), 2715, 2004 |
| 9 |
Copper deposition and subsequent grain structure evolution in narrow lines Brongersma SH, D'Haen J, Vanstreels K, DeCeuninck W, Vervoort I, Maex K Materials Science Forum, 426-4, 2485, 2003 |
| 10 |
A quantitative adhesion study between contacting materials in Cu damascene structures Lanckmans F, Brongersma SH, Varga I, Poortmans S, Bender H, Condard T, Maex K Applied Surface Science, 201(1-4), 20, 2002 |