검색결과 : 20건
| No. | Article |
|---|---|
| 1 |
Tribological, Thermal, and Wear Characteristics of Poly(phenylene sulfide) and Polyetheretherketone Retaining Rings in Interlayer Dielectric CMP Wei XM, Zhuang Y, Sampurno Y, Sudargho F, Wargo C, Borucki L, Philipossian A Electrochemical and Solid State Letters, 13(11), H391, 2010 |
| 2 |
Analyses of Diamond Disk Substrate Wear and Diamond Microwear in Copper Chemical Mechanical Planarization Process Meled A, Zhuang Y, Wei X, Cheng J, Sampurno YA, Borucki L, Moinpour M, Hooper D, Philipossian A Journal of the Electrochemical Society, 157(3), H250, 2010 |
| 3 |
Studying the effect of temperature on the copper oxidation process using hydrogen peroxide for use in multi-step chemical mechanical planarization models DeNardis D, Rosales-Yeomans D, Borucki L, Philipossian A Thin Solid Films, 518(14), 3903, 2010 |
| 4 |
A three-step copper chemical mechanical planarization model including the dissolution effects of a commercial slurry DeNardis D, Rosales-Yeomans D, Borucki L, Philipossian A Thin Solid Films, 518(14), 3910, 2010 |
| 5 |
Investigation of pad staining and its effect on removal rate in copper chemical mechanical planarization Lee H, Zhuang Y, Borucki L, Joh S, O'Moore F, Philipossian A Thin Solid Films, 519(1), 259, 2010 |
| 6 |
Characterization of thermoset and thermoplastic polyurethane pads, and molded and non-optimized machined grooving methods for oxide chemical mechanical planarization applications Sampurno Y, Borucki L, Zhuang Y, Misra S, Holland K, Boning D, Philipossian A Thin Solid Films, 517(5), 1719, 2009 |
| 7 |
Analysis of pads with slanted grooves for copper CMP Rosales-Yeomans D, DeNardis D, Borucki L, Suzuki T, Philipossian A Journal of the Electrochemical Society, 155(10), H750, 2008 |
| 8 |
Design and evaluation of pad grooves for copper CMP Rosales-Yeomans D, DeNardis D, Borucki L, Philipossian A Journal of the Electrochemical Society, 155(10), H797, 2008 |
| 9 |
Evaluation of pad groove designs under reduced slurry flow rate conditions during copper CMP Rosales-Yeomans D, DeNardis D, Borucki L, Suzuki T, Sampurno Y, Philipossian A Journal of the Electrochemical Society, 155(10), H812, 2008 |
| 10 |
Implications of wafer-size scale-up on frictional, thermal, and kinetic attributes of interlayer dielectric CMP process Rosales-Yeomans D, Borucki L, Doi T, Lujan L, Philipossian A Journal of the Electrochemical Society, 153(4), G272, 2006 |