화학공학소재연구정보센터
검색결과 : 27건
No. Article
1 High-Performance Magnetic Sensorics for Printable and Flexible Electronics
Karnaushenko D, Makarov D, Stober M, Karnaushenko DD, Baunack S, Schmidt OG
Advanced Materials, 27(5), 880, 2015
2 Wearable Magnetic Field Sensors for Flexible Electronics
Melzer M, Monch JI, Makarov D, Zabila Y, Bermudez GSC, Karnaushenko D, Baunack S, Bahr F, Yan CL, Kaltenbrunner M, Schmidt OG
Advanced Materials, 27(7), 1274, 2015
3 Direct Transfer of Magnetic Sensor Devices to Elastomeric Supports for Stretchable Electronics
Melzer M, Karnaushenko D, Lin GG, Baunack S, Makarov D, Schmidt OG
Advanced Materials, 27(8), 1333, 2015
4 Self-Assembled On-Chip-Integrated Giant Magneto-Impedance Sensorics
Karnaushenko D, Karnaushenko DD, Makarov D, Baunack S, Schafer R, Schmidt OG
Advanced Materials, 27(42), 6582, 2015
5 Biomimetic Microelectronics for Regenerative Neuronal Cuff Implants
Karnaushenko D, Munzenrieder N, Karnaushenko DD, Koch B, Meyer AK, Baunack S, Petti L, Troster G, Makarov D, Schmidt OG
Advanced Materials, 27(43), 6797, 2015
6 Hierarchically Designed SiOx/SiOy Bilayer Nanomembranes as Stable Anodes for Lithium Ion Batteries
Zhang L, Deng JW, Liu LF, Si WP, Oswald S, Xi LX, Kundu M, Ma GZ, Gemming T, Baunack S, Ding F, Yan CL, Schmidt OG
Advanced Materials, 26(26), 4527, 2014
7 Dynamic Molecular Processes Detected by Microtubular Opto-chemical Sensors Self-Assembled from Prestrained Nanomembranes
Ma LB, Li SL, Quinones VAB, Yang LC, Xi W, Jorgensen M, Baunack S, Mei YF, Kiravittaya S, Schmidt OG
Advanced Materials, 25(16), 2357, 2013
8 Nanomembrane Quantum-Light-Emitting Diodes Integrated onto Piezoelectric Actuators
Trotta R, Atkinson P, Plumhof JD, Zallo E, Rezaev RO, Kumar S, Baunack S, Schroter JR, Rastelli A, Schmidt OG
Advanced Materials, 24(20), 2668, 2012
9 Electrocrystallisation of CoFe alloys under the influence of external homogeneous magnetic fields-Properties of deposited thin films
Koza JA, Karnbach F, Uhlemann M, McCord J, Mickel C, Gebert A, Baunack S, Schultz L
Electrochimica Acta, 55(3), 819, 2010
10 Influence of incorporated non-metallic impurities on electromigration in copper damascene interconnect lines
Stangl M, Liptak M, Acker J, Hoffmann V, Baunack S, Wetzig K
Thin Solid Films, 517(8), 2687, 2009