화학공학소재연구정보센터
검색결과 : 14건
No. Article
1 Professor James V. Beck on his 80th birthday
Alifanov OM, Bardon JP, Blackwell B, Cole KD, DeMonte F, Dolan KD, Dowding KJ, Haji-Sheikh A, Keltner NR, McMasters RL, Minkowycz WJ, Nenarokomov A, Scott EP, Woodbury KA, Wright NT
International Journal of Heat and Mass Transfer, 53(13-14), 2581, 2010
2 Microscopic analysis of interfacial electrothermal phenomena -definition of a heat generation factor
Le Meur G, Bourouga B, Bardon JP
International Journal of Heat and Mass Transfer, 49(1-2), 387, 2006
3 Experimental study of heat transfer in oscillating flow
Bouvier P, Stouffs P, Bardon JP
International Journal of Heat and Mass Transfer, 48(12), 2473, 2005
4 Predictive model of dynamic thermal contact resistance adapted to the workpiece-die interface during hot forging process
Bourouga B, Goizet V, Bardon JP
International Journal of Heat and Mass Transfer, 46(3), 565, 2003
5 Estimation of thermal contact conductance during resistance spot welding
Loulou T, Bardon JP
Experimental Heat Transfer, 14(4), 251, 2001
6 The workpiece-die thermal contact during a hot forging process: validation of the thermal contact resistance assumption and influence of the workpiece constitutive law
Bourouga B, Goizet V, Bardon JP
International Journal of Heat and Mass Transfer, 44(21), 4107, 2001
7 Thermal contact resistance and adhesion studies on thin copper films on alumina substrates
Sakami D, Lahmar A, Scudeller Y, Danes F, Bardon JP
Journal of Adhesion Science and Technology, 15(12), 1403, 2001
8 Estimation of thermal contact resistance during the first stages of metal solidification process: I - experiment principle and modelisation
Loulou T, Artyukhin EA, Bardon JP
International Journal of Heat and Mass Transfer, 42(12), 2119, 1999
9 Estimation of thermal contract resistance during the first stages of metal solidification process: II - experimental setup and results
Loulou T, Artyukhin EA, Bardon JP
International Journal of Heat and Mass Transfer, 42(12), 2129, 1999
10 Correlation between the adhesion and the thermal contact resistance : effects of substrate surface ion bombardment etching
Lahmar A, Hmina N, Scudeller Y, Bardon JP
Thin Solid Films, 325(1-2), 156, 1998