검색결과 : 9건
No. | Article |
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1 |
Surface Modification of a Photo-Definable Epoxy Resin with Polydopamine to Improve Adhesion with Electroless Deposited Copper Schaubroeck D, Van Den Eeckhout E, De Baets J, Dubruel P, Van Vaeck L, Van Calster A Journal of Adhesion Science and Technology, 26(18-19), 2301, 2012 |
2 |
Toughening of Basalt Fiber-Reinforced Composites with a Cyclic Butylene Terephthalate Matrix by a Nonisothermal Production Method Baets J, Devaux J, Verpoest I Advances in Polymer Technology, 29(2), 70, 2010 |
3 |
Surface modification of an epoxy resin with polyamines via cyanuric chloride coupling Schaubroeck D, De Baets J, Desmet T, Dubruel P, Schacht E, Van Vaeck L, Van Calster A Applied Surface Science, 256(21), 6269, 2010 |
4 |
Introduction of amino groups on the surface of thin photo definable epoxy resin layers via chemical modification Schaubroeck D, De Baets J, Desmet T, Van Vlierberghe S, Schacht E, Van Calster A Applied Surface Science, 255(21), 8780, 2009 |
5 |
Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers Siau S, Vervaet A, Degrendele L, De Baets J, Van Calster A Applied Surface Science, 252(8), 2717, 2006 |
6 |
Optimization of microvia-technology using excimer laser for build-up layer application in microelectronics Vervaet A, Siau S, De Baets J, Manirambona B Applied Surface Science, 252(23), 8243, 2006 |
7 |
Properties of poly(butylene terephthatlate) polymerized from cyclic oligomers and its composites Parton H, Baets J, Lipnik P, Goderis B, Devaux J, Verpoest I Polymer, 46(23), 9871, 2005 |
8 |
Excimer laser microvia-technology in multichip modules Manirambona B, De Baets J, Vervaet A Applied Surface Science, 208, 171, 2003 |
9 |
Stabilizer concentration and local environment: Their effects on electroless nickel plating of PCB micropads Zhang S, De Baets J, Vereeken M, Vervaet A, Van Calster A Journal of the Electrochemical Society, 146(8), 2870, 1999 |