검색결과 : 5건
| No. | Article |
|---|---|
| 1 |
Bottom-Up Copper Filling of Large Scale Through Silicon Vias for MEMS Technology Menk LA, Josell D, Moffat TP, Baca E, Blain MG, Smith A, Dominguez J, McClain J, Yeh PD, Hollowell AE Journal of the Electrochemical Society, 166(1), D3066, 2018 |
| 2 |
Galvanostatic Plating with a Single Additive Electrolyte for Bottom-Up Filling of Copper in Mesoscale TSVs Menk LA, Baca E, Blain MG, McClain J, Dominguez J, Smith A, Hollowell AE Journal of the Electrochemical Society, 166(1), D3226, 2018 |
| 3 |
Molecular Components of the Sporothrix schenckii Complex that Induce Immune Response Alba-Fierro CA, Perez-Torres A, Toriello C, Romo-Lozano Y, Lopez-Romero E, Ruiz-Baca E Current Microbiology, 73(2), 292, 2016 |
| 4 |
Differential Response of Candida albicans and Candida glabrata to Oxidative and Nitrosative Stresses Cuellar-Cruz M, Lopez-Romero E, Ruiz-Baca E, Zazueta-Sandoval R Current Microbiology, 69(5), 733, 2014 |
| 5 |
Deposition of B4C/BCN/c-BN multilayered thin films by r.f. magnetron sputtering Bejarano G, Caicedo JM, Baca E, Prieto P, Balogh AG, Enders S Thin Solid Films, 494(1-2), 53, 2006 |