검색결과 : 1건
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1 |
Impurities in the Electroplated sub-50 nm Cu Lines: The Effects of the Plating Additives Huang Q, Avekians A, Ahmed S, Parks C, Baker-O'Neal B, Kitayaporn S, Sahin A, Sun Y, Cheng T Journal of the Electrochemical Society, 161(9), D388, 2014 |