검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Synchronous, In Situ Measurements in Chemical Mechanical Planarization Vlahakis J, Rogers C, Manno VP, White R, Moinpour M, Hooper D, Anjur S Journal of the Electrochemical Society, 156(10), H794, 2009 |
| 2 |
Analysis of large particle count in fumed silica slurries and its correlation with scratch defects generated by CMP Remsen EE, Anjur S, Boldridge D, Kamiti M, Li ST, Johns T, Dowell C, Kasthurirangan J, Feeney P Journal of the Electrochemical Society, 153(5), G453, 2006 |
| 3 |
Viewing asperity behavior under the wafer during CMP Gray C, Apone D, Rogers C, Manno VP, Barns C, Moinpour M, Anjur S, Philipossian A Electrochemical and Solid State Letters, 8(5), G109, 2005 |
| 4 |
Measurements of slurry film thickness and wafer drag during CMP Lu J, Rogers C, Manno VP, Philipossian A, Anjur S, Moinpourd M Journal of the Electrochemical Society, 151(4), G241, 2004 |