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| No. | Article |
|---|---|
| 1 |
Electrochemical Atomic Layer Deposition of Copper: A Lead-Free Process Mediated by Surface-Limited Redox Replacement of Underpotentially Deposited Zinc Venkatraman K, Gusley R, Yu L, Dordi Y, Akolkara R Journal of the Electrochemical Society, 163(12), D3008, 2016 |