| 1 |
Selective and Anisotropic Copper Electroplating Using Copper Overburden with an Inhibiting Additive
Haba T, Suzuki H, Yoshida H, Akahoshi H, Chinda A
Electrochemical and Solid State Letters, 13(5), D23, 2010 |
| 2 |
Effect of the Purity of Plating Materials on the Reduction of Resistivity of Cu wires for Future LSIs
Onuki J, Tashiro S, Khoo K, Ishikawa N, Kimura T, Chonan Y, Akahoshi H
Journal of the Electrochemical Society, 157(9), II857, 2010 |
| 3 |
Efficient oxidative coupling polymerization for synthesis of thermosetting poly(phenylene ether) copolymer with a low dielectric loss
Nunoshige J, Akahoshi H, Shibasaki Y, Ueda M
Journal of Polymer Science Part A: Polymer Chemistry, 46(15), 5278, 2008 |
| 4 |
Low dielectric loss copolymer obtained from 2,6-dimethylphenol and 2-allyl-6-methylphenol via Cu-catalyzed oxidative coupling polymerization
Nunoshige J, Akahoshi H, Shibasaki Y, Ueda M
Chemistry Letters, 36(2), 238, 2007 |
| 5 |
Reaction-induced phase decomposition of thermoset/thermoplastic blends investigated by energy filtering transmission electron microscopy
Liao YG, Horiuchi S, Nunoshige J, Akahoshi H, Ueda M
Polymer, 48(13), 3749, 2007 |
| 6 |
Electroless deposited cobalt-tungsten-boron capping barrier metal on damascene copper interconnection
Nakano H, Itabashi T, Akahoshi H
Journal of the Electrochemical Society, 152(3), C163, 2005 |
| 7 |
Binary mixed solvent electrolytes containing trifluoropropylene carbonate for lithium secondary batteries
Arai J, Katayama H, Akahoshi H
Journal of the Electrochemical Society, 149(2), A217, 2002 |
| 8 |
Impedance of a reaction involving two adsorbed intermediates: aluminum dissolution in non-aqueous lithium imide solutions
Peter L, Arai J, Akahoshi H
Journal of Electroanalytical Chemistry, 482(2), 125, 2000 |
| 9 |
Solvation states and properties of binary mixtures of halogenated cyclic carbonates and a linear carbonate
Katayama H, Arai J, Akahoshi H
Journal of Power Sources, 81-82, 705, 1999 |
