검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Ultrasonic characterization of the interface between a die attach adhesive and a copper leadframe in IC packaging Guo N, Abdul J, Du H, Wong BS Journal of Adhesion Science and Technology, 16(9), 1261, 2002 |
| No. | Article |
|---|---|
| 1 |
Ultrasonic characterization of the interface between a die attach adhesive and a copper leadframe in IC packaging Guo N, Abdul J, Du H, Wong BS Journal of Adhesion Science and Technology, 16(9), 1261, 2002 |