| 학회 |
한국고분자학회 |
| 학술대회 |
2006년 봄 (04/06 ~ 04/07, 일산킨텍스) |
| 권호 |
31권 1호 |
| 발표분야 |
기능성 고분자 |
| 제목 |
Improved adehesion between Kapton film and copper metal by coupling reaction |
| 초록 |
Polyimides are used as dielectric layers in a variety of microelectronic applications since they have low dielectric constant, high thermal stability, and good mechanical properties. However, the ashesion of metals directly to the polyimide film is usually poor due to the inertness of polyimide surface. The direct deposition of copper metal onto the PI film surfaces will be possible for manufacturing FPCB without an adhesive. It is possible to modify polyimide film surfaces to obtain the desired surface properties. In this study, polyimide films were initially modified by wet process with KOH aqueous solutions and then coupling agent was introduced by chemical reaction to improve adhesion properties with copper. The surfaces and morphologies of modified PI films and copper sputtered polyimide films were investigated. The peel strength, and interface of copper electroplated and deposited PI films will be discussed. |
| 저자 |
김화진1, 강형대1, 이재흥1, 한학수2, 홍영택1
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| 소속 |
1한국화학(연), 2연세대 |
| 키워드 |
polyimide film; copper; surface modification
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| E-Mail |
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