| 학회 | 한국고분자학회 |
| 학술대회 | 2005년 봄 (04/14 ~ 04/15, 전경련회관) |
| 권호 | 30권 1호, p.404 |
| 발표분야 | 기능성 고분자 |
| 제목 | Adhesion improvement of two layer flexible copper cladding laminates with imidazole-silane coupling agent |
| 초록 | Polyimide (PI) possess many outstanding properties, such as thermoxidative stability, excellent mechanical strength, low dielectric constants and superior chemical resistance. In the application for microelectronic devices, PI is frequently used as a composite with copper metal, for example in flexible printed circuit boards (FPCB). In the composite with copper metal which is deposited on the PI film surfaces by sputtering techniques, PI film surfaces must be modified due to its poor adhesion with copper metal. Its surface should be modified by ion-beam treatment to improve adhesion properties due to poor adhesion with copper. In this study, we investigated the surface modification by a combination of ion beam treatment and coupling agent to improve the adhesion between PI film and copper. The PI film surface was first treated by ion-beam, followed by dipping it into a modified imidazole silane coupling agent solution. Fig.1. showed morphology of modified PI film surface by ion beam and coupling agent treatment. The morphology of modified PI film were analyzed by scanning electron microscopy (SEM), atomic force microscopy (AFM), electron spectroscopy for chemical analysis (ESCA) and 90o peel strength of flexible copper clad laminates were measured by the universal tensile meter (UTM) Fig 1. SEM and AFM image of modified polyimide film surface by ion-beam and coupling agent References 1. X.P.Zou, E.T.Kang, K.G.Neoh, Y.Zhang, K.L.Tan, C.Q.Cui and T.B.Lim , Polym.Adv.Technol.12,538-595(2001) 2. Z.J.Yu, E.T.Kang ,K.G.Neoh, Polymer 43,(2002)4137-4146 3. G.H.Yang, E.T.Kang, K.G.Neoh, Y.Zhang, K.L.Tan Colloid Pollym Sci 279:745-753(2001) |
| 저자 | 강형대1, 강휘원1, 김화진1, 서동학2, 홍영택1 |
| 소속 | 1한국화학(연), 2한양대 |
| 키워드 | polyimide; coupling agent; fccl; fpcb; sputtering |
