| 학회 | 한국재료학회 |
| 학술대회 | 2011년 봄 (05/26 ~ 05/27, 제주 휘닉스 아일랜드) |
| 권호 | 17권 1호 |
| 발표분야 | F. Display and optic Materials and processing(디스플레이 및 광 재료) |
| 제목 | Fabrication of aluminum nitride thick film for lighting emitting diodes on metal substrate by aerosol deposition method at room temperature |
| 초록 | Aluminum nitride (AlN) ceramics are attractive dielectric material for microelectronic packaging, electronic substrate, and heat sinks due to its high thermal conductivity, low dielectric constant and good matching of thermal expansion coefficient with that of silicon. Pure single AlN crystals have a thermal conductivity of approximately 300 W∙m-1∙K-1 parallel to c axis, while AlN polycrystalline ceramics possess much lower thermal conductivity values (30-260 W∙m-1∙K-1) which are mainly affected by oxygen content (total and lattice dissolved), microstructure, lattice defects etc. Therefore, AlN ceramics with full densification and high thermal conductivity can be achieved at high temperature (＞1800℃) to reduce contamination contents. Also, the quality of AlN is highly depended on processing conditions, so AlN-industries always faces with high cost, repeatability and reliability problems. Consequently, the research in AlN ceramic is oriented towards achieving low cost process method at low temperature with high quality properties and implementing innovative functional components through integration with metal or glass materials. For these reasons, we have been developing a new deposition technique, named the aerosol deposition method (ADM), based on impact adhesion of fine particles for thick ceramic layers. ADM is a novel and very attractive coating technique with low cost for ceramic integration at room temperature. The ADM is based on impact consolidation of submicrometer ceramic particles that are accelerated in a carrier gas to high velocities of 100–600 m/s. During impact and interaction with the substrate, these particles are divided into small crystallites and form dense ceramic films on the substrate. In this study, we applied the ADM process to the fabrications of AlN thick films on metal substrate for thermal dissipation package material at room temperature. After ADM process, microstructure, thermal conductivity, adhesion strength properties characterized. |
| 저자 | 김민선, 조현민 |
| 소속 | 전자부품(연) |
| 키워드 | aerosol deposition method; aluminum nitride |
