화학공학소재연구정보센터
학회 한국고분자학회
학술대회 2010년 가을 (10/07 ~ 10/08, 대구 EXCO)
권호 35권 2호
발표분야 고분자 가공/복합재료
제목 Mold Preparation for the Residue-Free Processin Thermal Nanoimprinting
초록 Thermal nanoimprint has been used for fabricating optical, electronic, and organic devices. One inherent problem with the nanoimprint is the residual layer that remains after the imprint. In this talk, we present design rules for preparing mold that are necessary for inhibiting polymer instabilities in the condition of no residual layer after imprint. These rules are constraints on mold dimensions and are derived from dewetting considerations rather than polymer layer thickness, although there are also restrictions on polymer thickness for meeting the prerequisite. Also we will demonstrate nanoimprint with deformable elastomeric mold to generate self-modulating polymer resist patterns without residual layers and film instability. A constraint on the coated polymer layer thickness was derived in order to ensure that there is no residual layer left after patterning and at the same time that film stability is guaranteed without film dewetting within the cavity.
저자 윤현식, 차국헌
소속 서울대
키워드 Nanoimprint; Mold; Dewetting; Residual layer
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