화학공학소재연구정보센터
학회 한국화학공학회
학술대회 2003년 가을 (10/24 ~ 10/25, 한양대학교)
권호 9권 2호, p.2812
발표분야 재료
제목 A Study on Polyelectrolyte at Ceria-water interface for STI CMP
초록 CMP process is one of important steps in semiconductor fabrication. Particularly, CMP slurry is the most important consumable, which is composed of colloidal abrasives and various chemical additives. In this study, we investigated the effects of highly selective ceria slurry on shallow trench isolation (STI) CMP. Specifically, adsorption characteristics and chain conformation of polymer additives at ceria-water interface were studied to correlate colloidal behavior of CMP slurry with polishing properties such as material removal rate and selectivity of silicon oxide over silicon nitride. Interactions of polymer additives and ceria abrasives were examined in terms of pH, salt concentration, and types of salts to interpret the performance of STI CMP process. The effects of chain conformation of polyelectrolytes adsorbed onto the ceria slurry were investigated by using fluorescence spectroscopy, static contact angle measurement and zeta potential analysis. To do this, we have conducted CMP tests on thin films of silicon oxide and silicon nitride.Keywords: Ceria slurry, Anionic polyelectrolyte, Adsorption characteristic, Polymer conformation, STI CMP.
저자 김사라1, 소재현2, 김남수2, 이동준2, 양승만1
소속 1한국과학기술원, 2삼성전자
키워드 Ceria slurry; Anionic polyelectrolyte; Adsorption characteristic; Polymer conformation; STI CMP
E-Mail srkim96@kaist.ac.kr
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