| 초록 |
Epoxy-based polymers generally used for existing LED encapsulation provide stable light emission at junction temperatures up to 120 °C, but thermal stability past 150 °C is required for satisfactory device reliability and lifetime in some new LED designs, which include higher junction temperatures. Since silicon materials are of thermal stability, it would be suitable for encapsulation applications. Furthermore polyhedral oligomeric silsesquioxanes (POSS) materials are expected to be able to improve thermal, oxidative, and dimensional stability. Clearly, many nanocomposites can be designed using functionalized POSS derivatives in conjunction with traditional plastics and resins. In this study, we prepared POSS with oligomeric side chains (oligo-POSS) to render high thermal stability and hardness. The oligo-POSS encapsulant was characterized by 29Si-NMR, transmittance, refractive index, thermogravimetric analysis, and mechanical properties. |
