| 초록 |
Flame retarded epoxy resins are widely used in composites and as encapsulating materials for electronic products. Traditionally, brominated compounds and antinomy oxide are used to increase the epoxy resin flammability. Considering that the generation of toxic, corrosive, and halogenated gases and the release of toxic and endocrine-disrupting chemicals in combustion should be avoided, there is a trend toward using halogen-free flame retardants in epoxy resins. Phosphorus, silicon, and nitrogen compounds are the agents mostly used for replacing brominated compounds in flame retarding epoxy resins. In this work, the influence of the flame-retardant melamine on cure kinetics and thermal stability of epoxy/melamine system is investigated. Differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) are used to determine the cure activation energy (Ea) and thermal stability parameters of the blend system, respectively. Also, the thermal stability properties of epoxy/melamine system is discussed in with that of epoxy system containing commercial flame retardant, such as CR530.
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