| 학회 |
한국고분자학회 |
| 학술대회 |
2008년 봄 (04/10 ~ 04/11, 컨벤션 뷰로(대전)) |
| 권호 |
33권 1호 |
| 발표분야 |
기능성 고분자 |
| 제목 |
Thermally stable EMI shielding polyimide/SEDUST/poly(3,4-ethylenedioxythiophene) |
| 초록 |
Since the thermal stability is one of the most important points to be considered in certain the EMI shielding film, we used polyimide as the matrix for EMI shielding film. Applications of Polyimide/SENDUST/PEDOT film was polymerized in two steps. Firstly, poly amic acid (PAA) solution was obtained with pyromellitic dianhydride(PMDA) and 4,4-oxydianiline (ODA) in dimethylacetamide(DMAC). For the EMI shielding, SENDST was well dispersed in the PAA solution. Then the thermal imidization was performed at 80℃ for 20 min, 150℃ for 1hr and 210℃ for 1hr after casting the PAA solution using bar coater. Polymerization was confirmed by GPC and IR, and Thermal stability was investigated by TGA. Poly(3,4-ethylenedioxythioxythiophene) was polymerized on the polyimide/SENDUST film as follows. Power loss measured by micro-strip line method was about 80% at 1GHz. |
| 저자 |
전병국1, 이준영1, 한지은1, 손상훈1, 이경섭2, 조승현1, 김성훈2
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| 소속 |
1성균관대, 2창성 |
| 키워드 |
polyimide; EMI; Poly amic acid
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| E-Mail |
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