| 학회 |
한국재료학회 |
| 학술대회 |
2007년 봄 (05/10 ~ 05/11, 무주리조트) |
| 권호 |
13권 1호 |
| 발표분야 |
반도체재료 |
| 제목 |
Application of Electron Probe MicroAnalysis to Microelectronic Packaging |
| 초록 |
Electron probe microanalysis (EPMA) is one of the high-resolution analytical tools in materials characterization. EPMA is exploited as a spatially resolved quantitative elemental analysis technique based on the characteristic X rays by a focused electron beam. Compared to other counterparts, the EPMA offers quantification of elemental concentrations at levels as low as 100 parts per million and visual generation of 2-dimensional elemental mapping. KICET has recently completed the instrumentation of a state-of-art electron probe microanalyzer, JEOL JXA-8100 whose main functions are divided into elemental quantification and image analysis. The elemental quantification includes both energy-dispersive spectroscopy (EDS) and wavelength dispersive spectroscopy (WDS): in particular, the WDS system allows highly reliable determination of chemical elements in one- and two-dimensional configurations. Furthermore, the image analysis capability of EMPA enables one to generate secondary electron imaging (SE imaging), back-scattered electron imaging (BE imaging), and lastly X-ray mapping image. The analytical tools of the KICET EMPA offer the complete understanding in materials issue encountered in academia and industries. The current work reports the application of EMPA to microelectronic packaging. The model system is chosen as a flip-chip specimen for RF packaging. Sn bumps were formed on Ti/Ni UBM and reflowed after flip-chip bonding of the Cu columnar bumps at 250℃. Intermetallic compounds were formed and interfacial composition was changed by the reaction between the Sn and Cu bumps. The detailed EMPA analysis exhibits the quantification of packaging materials and the spatial distribution of the chemical elements of interest. |
| 저자 |
S.M. Bae1, Y.H. Lee2, W.S. Seo3, E.K. Choi3, T.S. Oh2, J.-H. Hwang2
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| 소속 |
1요업(세라믹기술원), 2홍익대, 3요업기술원 |
| 키워드 |
Application of EMPA to microelectronic packaging |
| E-Mail |
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