| 초록 |
Renovation required in the display process is the fine pattern formation process, which normally uses the semiconductor process based on expensive equipment, extreme process environment and photosensitive material. Current semiconductor process needs an expensive photomask and exposure radical, photoresist and sputtering. It is predicted that process reform for past several years reaches in limit of cost reduction. Research and development are achieved to accomplish process reform by applying ink jet or roll printing instead of semiconductor process for the method to accomplish this high price material waste and fine pattern formation process. However, in the case of the existing ink jet printing, the fine pattern application was obtained by reducing the nozzle diameter. This approach contains the problem that the yield rate of ink jet print head is fallen as the nozzle size is decrescent and process stability is fallen according as being blocked nozzle at process application. And in the case of the roll printing, when ink is decaled from master plate to board, the problems such as hangover is ever-present on master plate and mass high price ink should be engaged are indicated. Therefore, in this study, basis design and test to develop fine patterning equipment employing the hybrid R2R printing equipment were achieved as one approach to cope these problem. |
