| 학회 | 한국재료학회 |
| 학술대회 | 2020년 가을 (11/18 ~ 11/20, 휘닉스 제주 섭지코지) |
| 권호 | 26권 1호 |
| 발표분야 | 특별심포지엄7. 여성위원회 특별세션-오거나이저: 박상희(KAIST) |
| 제목 | Neutral Electroless Cu-alloy Plating for high power LED |
| 초록 | In the fabrication of PCBs (printed circuit boards) and other electronic devices, copper (Cu) and/or Cu alloy plating are widely used for metallization. By recent studies, the characteristics of electroless Cu-Ni alloys such as thermal stablility, corrosion resistance, solderability, magnetic and electrical properties, are superior to that of the electroless Ni plating. In high power LED, the thermal problem that is brought by heat generated within the LED itself is still a bottleneck that limits the stability, reliability and lifetime of high power LED. Accordingly, a ceramic Al2O3 layer is used as heat sinks of high power LED devices. Commercial electroless Cu and/or Cu-Ni alloy plating solutions are operated at pH values above 9~11. However, a near neutral (~pH 7) process is required in circuit formation on Al2O3 substrate for high-power PCB because Al2O3 substrate can be damaged by a strong acid and/or strong alkali solution. Although elelctroless Cu-alloy plating has been studied by some researchers, there is not report of electroless Cu alloy plating on PCB included ceramic Al2O3 layer for high power light-emitting diode (LED). In this study, we controlled the pH of electroless Cu-alloy plating solution to minimize a damage of substrate Al2O3 layer. According to various pH and plating temperature of electroless Cu-Ni plating solution, the characteristics of Cu alloy films were analyzed by XRD, XPS, XAS, and FE-SEM, etc. |
| 저자 | 이연승 |
| 소속 | 한밭대 |
| 키워드 | Neutral electroless; Cu-alloy; high power LED |
